Dual curing process for producing a seam

A process for forming a seamed puzzle cut component, by bonding mutually mating members of a seam wherein said component comprises a puzzle cut seam having a first side and a second side, and said seam comprising mutually mating members, each member having a puzzle cut form, wherein said process comprises:

• a) compounding an adhesive;
• b) forming said adhesive in contact with said first side of said seam and in further contact with said puzzle cut mutually mating members;
• c) contacting said adhesive and first side of said seam to a first heated clamp;
• d) contacting said second side of said seam to a second heated clamp;
• e) while said seam is still in contact with said first heated clamp and said second heated clamp, subjecting said adhesive in contact with said mutually mating members to a first cure at a first temperature;
• and
• f) while said seam is still in contact with said first heated clamp and said second heated clamp, subjecting said adhesive to a second cure at a second temperature to form a dual-cured adhesive, wherein said second temperature is higher than said first temperature.

A process for forming a seamed film component, by bonding mutually mating members of a seam wherein said film component comprises a seam having a first side and a second side and comprising mutually mating members, wherein said process comprises:

• a) compounding an adhesive comprising a hot-melt processable, thermosetting resin and an electrically conductive filler;
• b) forming said adhesive in contact with said first side of said seam and said mutually mating members;
• c) contacting said adhesive and first side of said seam to a first heated clamp;
• d) contacting said second side of said seam to a second heated clamp;
• e) while said seam is still in contact with said first heated clamp and said second heated clamp, subjecting said adhesive in contact with said mutually mating members to a first cure at a first temperature;
• and
• f) while said seam is still in contact with said first heated clamp and said second heated clamp, subjecting said adhesive to a second cure at a second temperature to form a dual-cured adhesive, wherein said second temperature is higher than said first temperature.

A process for forming a seamed film component, by bonding mutually mating members of a seam wherein said film component comprises a seam having a first side and a second side and said seam comprising mutually mating members in a puzzle cut form, wherein said mutually mating members comprise a first projection and a second receptacle geometrically oriented so that said second receptable on a first end receives the first projection on a second end, and wherein said first projection on the first end is received by the second receptacle on the second end, wherein said process comprises:

• a) compounding an adhesive;
• b) forming said adhesive in contact with said first side of said seam and said mutually mating members;
• c) contacting said adhesive and first side of said seam to a first heated clamp;
• d) contacting said second side of said seam to a second heated clamp;
• e) while said seam is still in contact with said first heated clamp and said second heated clamp, subjecting said adhesive in contact with said mutually mating members to a first cure at a first temperature;
• and
• f) while said seam is still in contact with said first heated clamp and said second heated clamp, subjecting said adhesive to a second cure at a second temperature to form a dual-cured adhesive, wherein said second temperature is higher than said first temperature.