Deposited film forming apparatus and deposited film forming method

A deposited film forming apparatus comprising:

• a vacuum chamber, a power applying electrode spaced above a grounded flat plate base member, said power applying electrode and said base member disposed in said vacuum chamber and a power source for supplying a power to the power applying electrode,
• the deposited film forming apparatus being constructed to supply the power from the power source to the power applying electrode so as to generate a plasma in a discharge space between the power applying electrode and a substrate disposed in opposition to the power applying electrode in the vacuum chamber, thereby decomposing a source gas introduced into the vacuum chamber to form a deposited film on the substrate,
• wherein the power applying electrode is fixed to the base member with a plurality of electrically insulating fastening members, at positions effective to suppress deformation of the power applying electrode, wherein an electrically insulating spacer is placed between the power supplying electrode and the base member to electrically insulate said power applying electrode from the base member.