Thermal stable low elastic modulus material and device using the same

A thermally stable low elastic modulus material obtained by heat-curing a mixture comprising a resin or resin precursor and an organosilicon compound represented by the following general formula 1, 2 of 3,

• wherein the resin contains at least one resin selected from the group consisting of polyimides, polyamides-imides and polyamides, and an elastic modulus measured at −50° C. of a cured product of the mixture is from 2 to 0.01 GPa,
• wherein R is an organic group capable of forming a covalent bond with the polyimide, polyamide-imide or polyamide, and R1 to R6 are independently of one or another of a silicon-containing group having 1 to 10 repeating units of SiRO3/2, provided that when a number of the repeating units is 0, R1 to R6 are independently of one or another of H, CH3 or C2H5.

A resin precursor varnish composition comprising a resin or resin precursor and an organosilicon compound represented by the following general formula 1, 2 or 3,

• wherein the varnish composition exhibits an elastic modulus measured at −50° C. of from 2 to 0.01 GPa, when cured, and the resin contains at least one resin selected from the group consisting of polyimides, polyamide-imides and polyamides,
• wherein R is an organic group capable of forming a covalent bond with the polyimide, polyamide-imide or polyamide, and R1 to R6 are independently of one or another of a silicon-containing group having 0 to 10 repeating units of SiRO3/2, provided that when a number of the repeating unit is 0, R1 to R6 are independently of one or another of H, CH3 or C2H5.