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US 6,638,328 B1Granted
Bimodal slurry system
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShen-Nan Lee, Tsu Shih, Syun Ming Jang
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Abstract
A bimodal slurry system for a chemical mechanical polishing process including a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said first particles having a mean particle diameter larger by at least a factor of 3 than a mean particle diameter of the at least one type of second particles said first particles further being compressible.
Claims19
A bimodal slurry system for a chemical mechanical polishing (CMP) process comprising:
- an aqueous dispersion comprising a plurality of first particles and a plurality of at least one type of second particles;
- said first particles having a mean particle diameter larger by at least a factor of 3 than a mean particle diameter of the at least one type of second particles;
- said first particles formed of either (1) a polymer material or (2) a porous inorganic material having an interconnecting porosity from about 20 to about 80 percent;
- said first particles further being compressible in a CMP process;
- said at least one type of second particles being deposited to surround the periphery of the first particles;
- said at least one type of second particles having a relatively higher hardness compared to the first particles.
3 more elements
Dependencies are inferred from the claim text.