Ion exchange materials for chemical mechanical polishing
AssigneeApplied Materials, Inc.
InventorsYuchun Wang, Stan D. Tsai, Kapila Wijekoon, Rajeev Bajaj, Fred C. Redeker
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Abstract
Ion exchange materials are employed in CMP methodologies to polish or thin a semiconductor substrate or a layer thereon. Embodiments include a polishing pad having an ion exchange material thereon and polishing a semiconductor substrate or a layer thereon with the polishing pad or a CMP composition including an ion exchange material therein and polishing the substrate or a layer thereon with the CMP composition or both.
Claims18
A method of polishing a substrate, the method comprising:
- providing a semiconductor substrate;
- and
- polishing the substrate with a CMP composition comprising an ion exchange polymer comprising a styrenic resin having at least one amine, pyridinyl group, picolylamine group, aminopyridines, or combinations thereof.
A method of polishing a substrate, comprising:
- providing a semiconductor substrate;
- forming a dielectric layer on the substrate;
- forming a barrier layer on the dielectric layer;
- forming a conductive layer that is a copper containing layer over the barrier layer;
- polishing the conductive layer with a CMP composition comprising an oxidizer in an aqueous carrier and an ion exchange polymer comprising a styrenic polymer having at least one amine or pyridinyl moiety that is in the form of beads having an average diameter of less than 1 micron to about 500 microns, and that is capable of complexing with copper or copper ions until a portion of the barrier layer is exposed;
- and
- polishing the barrier layer to expose a top surface of the dielectric layer.
A method of polishing a substrate, the method comprising:
- providing a semiconductor substrate;
- and
- polishing the substrate with a polishing pad, wherein the polishing pad comprises an ion exchange material comprising a styrenic resin having at least one amine, pyridinyl group, picolylamine group, aminopyridines, or combinations thereof.
A method of cleaning a substrate, the method comprising:
- providing a substrate having a bevel edge;
- providing a cleaning pad comprising a deformable ion exchange material comprising a styrenic resin having at least one amine, pyridinyl group, picolylamine group, aminopyridines, or combinations thereof;
- and
- polishing the bevel edge of the substrate with the cleaning pad.
A method of cleaning a substrate, the method comprising:
- providing a substrate having a bevel edge;
- providing a cleaning pad comprising a deformable ion exchange material comprising a styrenic resin having at least one amine, pyridinyl group, picolylamine group, aminopyridines, or combinations thereof;
- and
- polishing the substrate with the cleaning pad, wherein polishing the substrate with the cleaning pad comprises polishing a backside of the substrate.
Dependencies are inferred from the claim text.