Integrated ball grid array-pin grid array-flex laminate test assembly
AssigneeAgilent Technologies, Inc.
InventorsKenneth W Johnson, Brent A. Holcombe
Life of this patent
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Abstract
An integrated probe assembly provides the capability to test integrated circuit (IC) packages mounted onto ball grid arrays. The present invention comprises an unsealed BGA socket (102), nail head pins (107) which can be inserted flush into a pin carrier to produce a PGA header (103), a Flex circuit assembly comprising a piece of flexible circuit (104) with various passive resistors and connectors attached and solder preforms (113) used to solder the flex assembly to the pin grid array. Matched impedance connectors (105) are attached at an end of the flexible circuit.
Claims7
An integrated probe assembly for electrically connecting an integrated circuit package to a test instrument, comprising:
- a single BGA socket;
- a single PGA header comprising a plurality of nail head pins and a pin carrier, said PGA header being soldered to said BGA socket;
- a flexible circuit assembly inserted onto said PGA header;
- and
- a plurality of solder preforms inserted over said plurality of nail head pins, said preforms having been reflowed.
A system for probing bus trace signals from a processor, said system comprising:
- a single BGA ZIF socket;
- a single PGA header comprising a plurality of nail head pins and a pin carrier, said PGA header being soldered to said BGA socket;
- a flexible circuit assembly inserted onto said PGA header, said flexible circuit having a pair of matched impedance connectors soldered thereto;
- and
- a plurality of solder preforms inserted over said plurality of nail head pins, said preforms having been reflowed;
- wherein a processor is insertable into said BGA ZIF socket, said system is insertable into a motherboard ZIF socket and processor bus trace signals are capturable from said matched impedance connectors.
Dependencies are inferred from the claim text.