Inkjet head and method of manufacturing the same

An inkjet head, comprising:

• an ink ejection unit;
• and
• a plate including an ink ejection nozzle disposed in correspondence to the ink ejection unit so that an ink droplet is ejected from the ink ejection nozzle using the ink ejection unit,
• wherein the plate is arranged such that fine particles, which comprises silicone, are dispersed in a plate base member.

An inkjet head, comprising:

• an ink ejection unit;
• and
• a plate including an ink ejection nozzle disposed in correspondence to the ink ejection unit so that an ink droplet is ejected from the ink ejection nozzle using the ink ejection unit,
• wherein the plate contains fine particles having a water-repellent function and dispersed therein, and the dispersion density of the fine particles on a back side of the plate opposite to an ink ejection side thereof from which the ink droplet is ejected is lower than that of the fine particles on the ink ejection side.

A method of manufacturing an inkjet head comprising an ink ejection unit disposed on a substrate and a plate including an ink ejection nozzle disposed in correspondence to the ink ejection unit and containing fine particles, which have a water-repellent function and are dispersed in at least a region in proximity to a surface of the plate on an ink ejection side thereof, so that an ink droplet is ejected from the ink ejection nozzle using the ink ejection unit, the method comprising the steps of:

• bonding the plate along the substrate before the ink ejection nozzle is formed through the plate;
• forming the ink ejection nozzle under a first etching condition in which an etching rate of the fine particles in the region in proximity to the surface and an etching rate of a portion of the plate other than the fine particles in the region have predetermined magnitude relation so that the inner surface of the ink ejection nozzle is arranged as a flat surface;
• and
• etching the surface of the plate under a second etching condition which has magnitude relation different from the magnitude relation of the first etching condition so that the surface of the plate in a vicinity of an ink ejection opening of the thus formed ink ejection nozzle is arranged as a fine irregular surface on which the fine particles are exposed.