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US 6,637,641 B1Granted
Systems and methods for manufacturing a circuit board
AssigneeEMC Corporation
InventorsStuart D. Downes, Jin Liang
Life of this patent
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AssigneeEMC Corporation
InventorsStuart D. Downes, Jin Liang
Estimating the term…
A circuit board manufacturing system has a paste source, a circuit board processing apparatus, and a controller. The circuit board processing apparatus includes a carrier configured to receive a circuit board having (i) a section of circuit board material and (ii) virgin metallic surface mount pads supported by the section of circuit board material. The circuit board processing apparatus further includes a paste distribution assembly coupled to the carrier and to the paste source. The paste distribution assembly is configured to dispose a paste from the paste source onto a surface of the circuit board. The carrier further includes a surfacing assembly coupled to the carrier. The surfacing assembly is configured to move the paste over the surface of the circuit board to remove a portion of each virgin metallic surface mount pad. The controller is configured to selectively start and stop operations of the paste distribution and surfacing assemblies.
A circuit board manufacturing system, comprising
A circuit board processing apparatus, comprising:
A method for processing a circuit board, the method comprising the steps of:
A circuit board processing apparatus, comprising:
Dependencies are inferred from the claim text.