Wire processing apparatus, flux applying device, and solder depositing device

A flux applying device for applying a flux liquid to an exposed core on an end of a wire, said flux applying device comprising:

• a flux bath for storing said flux liquid therein;
• a flux liquid holding tube supported vertically movable between a raised position lying over said flux bath and a lowered position lying in said flux liquid, said flux liquid holding tube having a holding hole for holding said flux liquid therein;
• and
• moving means for movably supporting said wire and for releasably inserting said core into said holding hole of said flux liquid holding tube lying in said raised position.

A solder depositing device comprising:

• a flux bath for storing therein a flux liquid to be applied to an exposed core on an end of a wire;
• a solder bath for storing therein solder in a molten state to be deposited on said core;
• moving means for supporting said wire, said moving means being movable so as to cause said flux liquid to be applied to said core in a position of said flux bath and to cause said solder to be deposited on said core in a position of said solder bath;
• a support rod operated to move upwardly and downwardly;
• a flux liquid holding tube supported by a lower end of said support rod vertically movable between a first raised position lying over said flux bath and a first lowered position lying in said flux liquid, said flux liquid holding tube having a holding hole for holding said flux liquid therein and capable of releasably receiving said core therein;
• and
• a wire presser guide having a presser surface, said wire presser guide being supported by the lower end of said support rod and positioned over said solder bath with said core immersed in a solder portion raised by surface tension of said solder when said support rod is in a second raised position in which said flux liquid holding tube is in said first raised position, said presser surface downwardly pressing said core immersed in said solder when said support rod is in a second lowered position in which said flux liquid holding tube is in said first lowered position.

A wire processing apparatus comprising:

• moving means for moving a wire;
• and
• a wire processing unit installed on a placement section configured to perform processing on an end of the wire moved by the moving means, the wire processing unit comprising:
• a contact crimping unit configured to crimp a crimp contact onto the end of the wire;
• and
• a solder depositing unit configured to deposit solder onto an exposed core of the end of the wire,
• wherein the contact crimping unit and the solder depositing unit attachable to and removable from the placement section.

A flux applying device for applying a flux liquid to an exposed core of an end of a wire comprising:

• a flux bath configured to store the flux liquid therein;
• a flux liquid holding tube supported vertically movable between a raised position over the flux bath and a lowered position in the flux liquid, the flux liquid holding tube including a holding hole configured to hold the flux liquid therein;
• and
• moving means for movably supporting the wire and for releasably inserting the core into the holding hole of the flux liquid tube.

A solder depositing device comprising:

• a flux bath configured to store therein a flux liquid to be applied to an exposed core on an end of a wire;
• a solder bath configured to store therein solder in a molten state to be deposited on the core;
• moving means for supporting the wire, the moving means being movable to cause the flux liquid to be applied to the core in a position of the flux bath and to cause the solder to be deposited on the core in a position of the solder bath;
• a support rod operated to move upwardly and downwardly;
• a flux liquid holding tube supported by a lower end of the support rod vertically movable between a first raised position lying over the flux bath and a first lowered position lying in the flux liquid, the flux liquid holding tube having a holding hole adapted to hold the flux liquid therein and capable of releasably receiving the core therein;
• and
• a wire presser guide having a presser surface, the wire presser guide being supported by the lower end of the support rod and positioned over the solder bath with the core immersed in a solder portion raised by surface tension of the solder when the support rod is in a second raised position in which the flux liquid holding tube is in the first raised position, the presser surface downwardly pressing the core immersed in the solder when the support rod is in a second lowered position in which the flux liquid holding tube is in the first lowered position.