System for fabricating solder bumps on semiconductor components

A system for fabricating solder bumps on a semiconductor component having a plurality of electrodes comprising:

• a layer on the component having a plurality of openings on the electrodes;
• a first solution configured to activate the electrodes;
• a second solution configured to electrolessly deposit first metal layers on the electrodes, the second solution comprising nickel chloride, sodium hydroxyacetate, and sodium hypophosphate;
• a third solution configured to electrolessly deposit second metal layers on the first metal layers;
• and
• a wave soldering apparatus comprising a tank containing a molten solder, the apparatus configured to generate a molten solder wave, to move the component proximate to the wave, and to deposit the molten solder on the second metal layers.

A system for fabricating solder bumps on a semiconductor component having a plurality of electrodes comprising:

• a layer on the component having a plurality of openings on the electrodes;
• a first solution configured to activate the electrodes;
• a second solution configured to electrolessly deposit first metal layers on the electrodes;
• a third solution configured to electrolessly deposit second metal layers on the first metal layers, the third solution comprising palladium chloride and sodium hypophosphate;
• and
• a wave soldering apparatus comprising a tank containing a molten solder, the apparatus configured to generate a molten solder wave, to move the component proximate to the wave, and to deposit the molten solder on the second metal layers.

A system for fabricating solder bumps on a semiconductor component having a plurality of electrodes comprising:

• a wafer containing the component comprising a layer having a plurality of openings on the electrodes;
• a first solution configured to activate the electrodes;
• a second solution configured to electrolessly deposit first metal layers on the electrodes;
• a third solution configured to electrolessly deposit second metal layers on the first metal layers;
• and
• a wave soldering apparatus comprising a tank containing a molten solder, the apparatus configured to generate a molten solder wave, to move the component proximate to the wave, and to deposit molten solder bumps on the second metal layers.

A system for fabricating solder bumps on a semiconductor component having a plurality of electrodes comprising:

• a wafer containing the component comprising a layer having a plurality of openings on the electrodes;
• a first solution configured to activate the electrodes;
• a second solution configured to electrolessly deposit first metal layers on the electrodes, the second solution comprising nickel chloride, sodium hydroxyacetate, and sodium hypophosphate;
• a third solution configured to electrolessly deposit second metal layers on the first metal layers;
• and
• a wave soldering apparatus comprising a tank containing a molten solder, the apparatus configured to generate a molten solder wave, to move the component proximate to the wave, and to deposit molten solder bumps on the second metal layers.

A system for fabricating solder bumps on a semiconductor component having a plurality of electrodes comprising:

• a wafer containing the component comprising a layer having a plurality of openings on the electrodes;
• a first solution configured to activate the electrodes;
• a second solution configured to electrolessly deposit first metal layers on the electrodes;
• a third solution configured to electrolessly deposit second metal layers on the first metal layers, the third solution comprising palladium chloride and sodium hypophosphate;
• and
• a wave soldering apparatus comprising a tank containing a molten solder, the apparatus configured to generate a molten solder wave, to move the component proximate to the wave, and to deposit molten solder bumps on the second metal layers.

A system for fabricating solder bumps on a semiconductor component having a plurality of electrodes comprising:

• a layer on the component having a plurality of openings on the electrodes;
• a zincate solution configured to activate the metal electrodes;
• a nickel chloride solution comprising sodium hypophosphate, configured to electrolessly deposit nickel layers on the electrodes;
• a palladium chloride solution comprising sodium hypophosphate, configured to electrolessly deposit palladium layers on the nickel layers;
• and
• a wave soldering apparatus comprising a tank containing molten solder, the apparatus configured to generate a molten solder wave, to move the component proximate to the wave, and to deposit molten solder bumps on the nickel layers.