Multi-material heat spreader
AssigneeSun Microsystems, Inc.
InventorsVadim Gektin, Deviprasad Malladi
Life of this patent
Estimating the term…
Abstract
In an embodiment, an apparatus for enhancing a thermal match between portions of a semiconductor device is disclosed. The apparatus includes a die and a heat spreader. The heat spreader is in thermal contact with the die. The heat spreader has a center portion and a perimeter portion. The center portion and the perimeter portions are structurally coupled to each other. In another embodiment, the perimeter portion of the heat spreader is selected from material with a lower CTE than the material for the center portion of the heat spreader.
Claims28
A method of enhancing a thermal match between portions of a semiconductor device, the method comprising:
- providing a die;
- and
- providing a heat spreader in thermal contact with the die, the heat spreader having a center portion and a perimeter portion, the center portion and the perimeter portions being structurally coupled to each other, the center portion including a plurality of sections;
- wherein the perimeter portion of the heat spreader is selected from material with a lower CTE than the material for the center portion of the heat spreader.
An apparatus for enhancing a thermal match between portions of a semiconductor device, the apparatus comprising:
- a die;
- and
- a heat spreader in thermal contact with the die, the heat spreader having a center portion and a perimeter portion, the center portion and the perimeter portions being structurally coupled to each other, the center portion including a plurality of sections;
- wherein the perimeter portion of the heat spreader is selected from material with a lower CTE than the material for the center portion of the heat spreader.
A apparatus for enhancing a thermal match between portions of a semiconductor device, the apparatus comprising:
- a die;
- and
- heat spreading means in thermal contact with the die, the heat spreading means having a center portion and a perimeter portion, the center portion and the perimeter portions being structurally coupled to each other, the center portion including a plurality of sections;
- wherein the perimeter portion of the heat spreading means is selected from material with a lower CTE than the material for the center portion of the heat spreading means.
Dependencies are inferred from the claim text.