Wafer for use in the selective connecting and disconnecting of plastic tubes
AssigneeDenco, Inc.
InventorDudley W. C. Spencer
Life of this patent
Estimating the term…
Abstract
A wafer for use in selectively connecting and disconnecting plastic tubes is in the form of a heatable plate having side walls and having a leading end and a trailing end. An outwardly extending scoop is formed on each of the side walls between and spaced from the leading end and the trailing end. A pair of slits is formed in the trailing end in line with the scoops for reducing the amount of plastic material remaining on the wafer.
Claims20
A wafer for use in a device for selectively connecting and disconnecting plastic tubes, said wafer being in the form of a heatable plate having opposed side walls and having a leading end and a trailing end, an outwardly extending scoop formed on each of said side walls between and spaced from said leading end and said trailing end, each of said scoops being open toward said leading end to remove a portion of the material of the plastic tubes as the wafer is moved between and in contact with exposed portions of the plastic tubes, and a plurality of exposed slits formed in said trailing end in line with said scoops for reducing the amount of plastic material remaining on said wafer.
A wafer for use in a device for selectively connecting and disconnecting plastic tubes, said wafer being in the form of a heatable plate having opposed side walls and having a leading end and a trailing end, an outwardly extending scoop formed on each of said side walls between and spaced from said leading end and said trailing end, each of said scoops being open toward said leading end to remove a portion of the material of the plastic tubes as the wafer is moved between and in contact with exposed portions of the plastic tubes, at least one exposed wafer formed in said trailing end in line with said scoops for reducing the amount of plastic material remaining on said wafer, and said at least one slit having a length of no greater than 5 mm.
Dependencies are inferred from the claim text.