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US 6,637,443 B2Granted
Semiconductor wafer cleaning apparatus and method
AssigneeLG Semicon Co., Ltd.
InventorsYun Jun Huh, Suk Bin Han, Jae Jeong Kim
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Abstract
A semiconductor wafer cleaning apparatus comprises an outer tank, a cleaning tank provided within the outer tank, a wafer carrier provided within the cleaning tank, a plurality of jet nozzles directed toward the wafer carrier, a main pipe connected to the jet nozzles, a circulating pump connected to the main pipe and the outer tank for circulating a cleansing solution from the outer tank, through the main pipe, the jet nozzles, and the cleaning tank, and a filter for filtering the circulated cleansing solution.
Claims8
A method of cleaning a semiconductor wafer comprising the steps of:
- placing a wafer inside a cleaning environment;
- and
- jetting a liquid against said wafer within said cleaning environment,
- wherein the step of placing a wafer includes placing the wafer inside a wafer carrier in the cleaning environment, and wherein the step of jetting includes
- directing a plurality of jet nozzles towards said water, each of said plurality of jet nozzles is located at a bottom center of the cleaning environment with the plurality of jet nozzle holes facing upward and a second of the plurality of jet nozzles is located at both sides of the cleaning environment with the plurality of jet nozzles holes facing a center of the wafer carrier at an oblique angle;
- and
- jetting the liquid directly onto left, right, and bottom sides of the wafer from the plurality of jet nozzles.
4 more elements
Dependencies are inferred from the claim text.