Field replaceable packaged refrigeration heat sink module for cooling electronic components
AssigneeSun Microsystems, Inc.
InventorAli Heydari Monfarad
Life of this patent
Estimating the term…
Abstract
A field and/or customer replaceable packaged refrigeration heat sink module is suitable for use in standard electronic component environments. The field replaceable packaged refrigeration heat sink module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. As a result, the field replaceable packaged refrigeration heat sink module can be utilized in existing electronic systems without the need for board or cabinet/rack modification or the “plumbing” associated with prior art liquid-based cooling systems.
Claims37
A packaged refrigeration heat sink module for cooling electronic components, said packaged refrigeration heat sink module comprising:
- a packaged refrigeration heat sink module housing;
- refrigerant;
- a compressor;
- a condenser;
- an expansion device;
- and
- an evaporator;
- wherein,
- said compressor, said condenser, said expansion device and said evaporator are coupled together in a refrigeration loop within said packaged refrigeration heat sink module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration heat sink module is a self-contained module;
- wherein,
- said packaged refrigeration heat sink module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches.
A circuit board, said circuit board comprising:
- at least one electronic component;
- and
- a packaged refrigeration heat sink module for cooling said electronic component, said packaged refrigeration heat sink module comprising:
- a packaged refrigeration heat sink module housing;
- refrigerant;
- a compressor;
- a condenser;
- an expansion device;
- and
- an evaporator;
- wherein,
- said compressor, said condenser, said expansion device and said evaporator are coupled together in a refrigeration loop within said packaged refrigeration heat sink module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration heat sink module is a self-contained module;
- further wherein,
- said packaged refrigeration heat sink module is mounted directly over a first surface of said electronic component;
- wherein,
- said packaged refrigeration heat sink module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches.
An electronic system, said electronic system comprising:
- a rack unit, said rack unit comprising:
- at least one electronic component;
- and
- a packaged refrigeration heat sink module for cooling said electronic component, said packaged refrigeration heat sink module comprising:
- a packaged refrigeration heat sink module housing;
- refrigerant;
- a compressor;
- a condenser;
- an expansion device;
- and
- an evaporator;
- wherein,
- said compressor, said condenser, said expansion device and said evaporator are coupled together in a refrigeration loop within said packaged refrigeration heat sink module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration heat sink module is a self-contained module;
- wherein,
- said packaged refrigeration heat sink module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches.
Dependencies are inferred from the claim text.