Method of manufacturing a multilayer printed wiring board

A Method for manufacturing a multilayer printed wiring board formed by laminating a plurality of laminates comprising:

• forming a laminate by forming conductive films on both sides of an insulative substrate;
• forming a plurality of approximately cylindrical conduction holes on said laminate;
• forming a conductive layer on the inner peripheral surface of said conduction hole and on said conductive film to thereby render said laminate conductive between both sides thereof;
• filling said conduction hole with a filling layer;
• planarizing the surface of said laminate;
• patterning said conductive film and said conductive layer desirably;
• forming a plurality of projection members on predetermined positions on said conductive film;
• forming a plurality of bonding members having a plurality of through holes;
• and
• laminating said laminates and said bonding members alternately with inserting said projection members into said through holes and for heat-press molding the laminated layers;
• wherein said laminate is electrically connected by means of a process in which conductive paste is coated between said projection member to be bonded and said conductive film, and said laminate and said bonding member that have been laminated are subjected to press-heating;
• and
• wherein said laminate is electrically connected by means of a process in which conductive plated layers are formed on the surface of said projection member to be bonded and the surface of said conductive film, and said laminate and said bonding member that have been laminated are subjected to press-heating.