Semiconductor device having high-density packaging thereof

A method of manufacturing a semiconductor device comprising:

• providing a wiring substrate having a substrate first surface and a substrate second surface opposite to the substrate first surface, the wiring substrate having a plurality of conductive lines formed on the substrate first surface and a through hole extending between the substrate first and second surfaces;
• putting an adhesive sheet on the substrate second surface so that the adhesive sheet is exposed through the through hole;
• providing a semiconductor IC chip having a chip first surface, a chip second surface opposite to the chip first surface and a plurality of chip side surfaces extending between the chip first and second surfaces, the semiconductor IC chip including a plurality of bond pads formed on the chip first surface;
• positioning the semiconductor IC chip on the exposed adhesive sheet in the through hole;
• providing a stage having a chip area for mounting the semiconductor IC chip;
• aligning the stage with the wiring substrate so that a level of the substrate first surface is substantially equal to a level of the chip first surface;
• electrically connecting the bond pads with the conductive lines by a plurality of conductive members, respectively;
• coating the conductive members, the chip first surface chip side surfaces, the through hole and a part of the substrate first surface, with a sealing resin;
• and
• detaching the stage from the semiconductor IC chip, leaving substantially only the sealing resin physically connecting the semiconductor IC chip with the wiring substrate.

A method of manufacturing a semiconductor device comprising:

• providing a wiring substrate having a substrate first surface and a substrate second surface opposite to the substrate first surface, the wiring substrate having a plurality of conductive lines formed on the substrate first surface and a through hole extending between the substrate first and second surfaces;
• providing a semiconductor IC chip having a chip first surface, a chip second surface opposite to the chip first surface and a plurality of chip side surfaces extending between the chip first and second surfaces, the semiconductor IC chip including a plurality of bond pads on the chip first surface;
• providing a stage having a chip area for mounting the semiconductor IC chip;
• mounting the semiconductor IC chip on the chip area of the stage;
• aligning the stage with the wiring substrate so that the semiconductor chip is located in the through hole, and a level of the substrate first surface is substantially equal to a level of the chip first surface;
• locating a pattern of conductive paste on a transfer roller;
• moving the transfer roller on the substrate first surface and the chip first surface with a rotation so that the bond pads and the conductive lines are connected by the pattern of conductive paste, respectively;
• and
• coating the pattern of conductive paste, the chip first surface, the chip side surfaces, the through hole and a part of the substrate first surface with a sealing resin, wherein the sealing resin is a substantially sole member physically connecting the semiconductor IC chip with the wiring substrate.

A method of manufacturing a semiconductor device comprising:

• providing a wiring substrate having a substrate first surface and a substrate second surface opposite to the substrate first surface, the wiring substrate having a plurality of conductive lines formed on the substrate first surface and a through hole extending between the substrate first and second surfaces;
• putting an adhesive sheet on the substrate second surface so that the adhesive sheet is exposed through the through hole;
• providing a semiconductor IC chip having a chip first surface, a chip second surface opposite to the chip first surface and a plurality of chip side surfaces extending between the chip first and second surfaces, the semiconductor IC chip including a plurality of bond pads formed on the chip first surface;
• positioning the semiconductor IC chip on the exposed adhesive sheet in the through hole;
• providing a stage having a chip area for mounting the semiconductor IC chip;
• aligning the stage with the wiring substrate so that a level of the substrate first surface is substantially equal to a level of the chip first surface;
• locating a pattern of conductive paste on a transfer roller;
• moving the transfer roller on the substrate first surface and the chip first surface with a rotation so that the bond pads and the conductive lines are connected by the pattern of conductive paste, respectively;
• and
• coating the pattern of conductive paste, the chip first surface, the chip side surfaces, the through hole and a part of the substrate first surface with a sealing resin, wherein the sealing resin is a substantially sole member physically connecting the semiconductor IC chip with the wiring substrate.