Flat panel display device including slitted tape carrier packages and manufacturing method thereof
AssigneeNEC LCD Technologies, Ltd.
InventorTsutomu Kanatsu
Life of this patent
Estimating the term…
Abstract
In a flat panel display device, in which a display panel 1 loosely fitted on a main surface of a chassis 4 and circuit substrates held in hook portions provided on side surfaces of the chassis are connected each other through TCP's by bending the latter TCP's, and a method for manufacturing the same device, a main slit for a rounded portion of each TCP is formed in a rounded portion of the TCP and an auxiliary sub slit is also formed adjacent to the main slit. In order to reduce the peeling force exerted on connecting/fixing portions between the TCP's and the display panel, the circuit substrate is pulled up by bending the main and sub slits and then returning the sub slit to a flat state to insert the circuit substrate into the hook portions.
Claims13
A flat panel display device comprising:
- a chassis;
- a display panel put on a main surface of said chassis;
- a circuit substrate held in a hook portion provided on a side surface of said chassis;
- and
- a plurality of TCP's, each said TCP having first and second ends, said first end connected to said display panel and said second end connected to said circuit substrate, each said TCP having a rounded region disposed between said first and second ends and a first region comprising the portion of each said TCP disposed between said first end and said rounded region;
- wherein said first region comprises a flexible region having a higher flexibility than that of the rest of said first region.
A method for manufacturing a flat panel display device comprising the steps of:
- holding a display panel having TCP's connected to a circuit substrate on a chassis, said TCP's each having first and second ends, a rounded portion slit and an auxiliary slit, said rounded portion slit disposed between said first and second ends, and said auxiliary slit disposed between said first end and said rounded portion slit;
- pulling up said circuit substrate by bending each said TCP at said rounded portion slit and said auxiliary slit provided in each said TCP such that a lowest end of said circuit substrate is higher than the highest point of a front edge of a hook portion provided on said chassis;
- and
- inserting said circuit substrate into said hook portion by returning said auxiliary slit to an original flat state.
Dependencies are inferred from the claim text.