Temperature control device for an electronic component

#The present invention relates generally to test equipment for electronic devices. More particularly, the present invention relates to a temperature control device for maintaining constant operating temperature of an electronic device under test.

#Electronic devices, such as integrated circuit chips, are usually tested prior to use. Device manufacturers typically perform a number of electrical and physical tests to ensure that the devices are free from defects and that the devices function according to their specifications. Common types of device testing include burn-in testing and electrical performance testing.

#The operating temperature of an electronic device under test (DUT) is an important test parameter that usually requires careful monitoring and/or regulating. For example, an electrical test procedure may designate a number of specific test temperatures or a specific range of test temperatures. Consequently, the prior art is replete with different types of temperature control systems, heat sink components, and heater elements designed to heat, cool, and otherwise control the operating temperature of a DUT. These temperature control systems are designed to maintain a steady state DUT operating temperature during the electronic testing procedure. However, it can be difficult to regulate the temperature of a DUT if the DUT exhibits rapid or excessive internal temperature changes while being tested; the electronic devices within the DUT often generate heat which causes such internal temperature changes.

#A more complete understanding of the present invention may be derived by referring to the detailed description and claims when considered in conjunction with the following Figures, wherein like reference numbers refer to similar elements throughout the Figures.

#FIG. 1 is a schematic diagram of an active thermal control (ATC) system for regulating the temperature of a device under test (DUT);

#FIG. 2 is a perspective view of a heating/cooling assembly that may be used in the ATC system depicted in FIG. 1;

#FIG. 1 is a schematic diagram of an active thermal control (ATC) system 100 for regulating the temperature of a device under test (DUT) 102. For purposes of the example embodiment described herein, DUT 102 is an electronic semiconductor circuit device, such as a microprocessor chip. Alternatively, DUT 102 may be any electronic, mechanical, or other device being subjected to one or more tests performed under specific temperature settings. ATC system 100 may cooperate with a suitable testing system (not shown) that provides a power supply, input signals, and possibly other inputs to DUT 102. A typical testing system also monitors a number of outputs and signals generated by DUT 102 during the test procedure.

#DUT 102 is preferably held against or in close proximity to a heating/cooling assembly 104, which is configured to concurrently provide a hot source and a cold source to DUT 102. In the preferred embodiment, a portion of DUT 102, such as the device lid, contacts heating/cooling assembly 104. In a practical embodiment, heating/cooling assembly 104 is coupled to a chuck assembly (not shown) and DUT 102 is cradled in a compatible carrier (not shown). The chuck assembly and carrier are clamped together during thermal conditioning, testing, and cool-down of DUT 102. In response to such clamping, DUT 102 is forced into physical contact with heating/cooling assembly 104. Such clamping ensures that heat is effectively transferred between DUT 102 and heating/cooling assembly 104. Alternatively, DUT 102 may be held against heating/cooling assembly 104 using a vacuum device or any suitable holding mechanism.

#The temperature of heating/cooling assembly 104 (in particular, the temperature of the hot source or heater element) is regulated by a suitably configured regulator, e.g., a control system 106. In the illustrated embodiment, control system 106 generates a heater control signal 108 that serves as an input signal to a heater element contained in heating/cooling assembly 104. Heater control signal 108 may be generated by control system 106 in response to one or more testing criteria, operating conditions, or feedback signals. For example, control system 106 may generate heater control signal 108 in response to any of the following parameters: a test temperature setting associated with the current testing specification for DUT 102; an input signal utilized by DUT 102, e.g., an input power signal, an input voltage, or an input current; a signal indicative of the real-time operating temperature of DUT 102; a signal indicative of the real-time operating temperature of an internal component of DUT 102, e.g., a semiconductor die; a signal indicative of the real-time temperature of a portion of heating/cooling assembly 104; the RF signature of DUT 102; or the like.