Loading patent…
AssigneeHitachi, Ltd.
InventorsToyoki Asada, Yuji Fujita, Hideo Sotokawa, Kazumi Kawamoto, Kunio Matsumoto, Shinya Hamagishi, Mari Matsuyoshi
Estimating the term…
An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.
An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another, comprising:
An optical transmission module, which is equipped with an optical module which has a semiconductor element that converts voltages and light and a driver IC which controls voltages applied to said light-emitting element, and in which terminals of said driver IC and wiring terminals of the circuit substrate are soldered together in a position so as to face one another, comprising:
Dependencies are inferred from the claim text.