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AssigneeNEC Tokin Corporation
InventorsShigeyoshi Yoshida, Hiroshi Ono, Koji Kamei
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In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (μm) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.
A bonding wire of high frequency current suppression type for an electronic component, comprising a conductor for connecting electronic components and predetermined places, said conductor has a high frequency current suppressor formed on at least a part of a surface of the conductor, said high frequency current suppressor attenuating a high frequency current passing through the above conductor itself in a bandwidth from a few tens MHZ and a few GHz, and being a magnetic loss material in a M-X—Y system, the magnetic loss material being made of a compound of composition elements M, Y and X, wherein M donates at least one of Fe, Co and Ni, Y donates at least one of F, N and O, and X donates at least one of elements other than that of included in M and Y, said composition element M existing in the form of granularity distributed in a matrix of a compound of the composition element X and a composition element Y.
A bonding wire of high frequency current suppression type for an electronic component, comprising a conductor for connecting electronic components and predetermined places, wherein a high frequency current suppressor for attenuating a high frequency current passing through the above conductor itself in a bandwidth from a few tens MHz and a few GHz, is formed on at least a part of a surface of the conductor, the high frequency current suppressor being (i) formed in a manner such that at least a connecting portion at both ends of the conductor would be exposed, and (ii) formed in a shape selected from the group consisting of a lattice shape and a spiral shape.
Dependencies are inferred from the claim text.