US 6,635,958 B2Granted

Surface mount ceramic package

AssigneeDover Capital Formation Group

InventorsDavid A. Bates, Stephen J. Oot, Robert J. Street, Brian L. Rowden

Life of this patent

Estimating the term…

Loading patent…

Abstract

A surface mount ceramic package, e.g. for a microwave or millimeter wave integrated circuit device, has outer conductive pads that are available for direct connection with traces on the printed circuit board. A metal core or base has spaces at one or more sides, e.g., voids or cutouts, where the outer pads are located. There is a first ceramic layer disposed on the core, with a central cavity for the die, and an upper or second ceramic layer. Printed traces are buried between the two layers, and vias connect the traces with the outer pads. Inner pads are located on a ledge of the first layer adjacent the cavity for connection with electrodes of the die. Each of the first and second ceramic layers may be stacked ceramic tape. The package may be LTCC or HTCC. This construction avoids inductive losses, especially at higher frequencies.

Claims9

Dependent claims

A surface mount ceramic package for housing an integrated circuit die and adapted to be mounted directly onto a printed circuit board on which there are metallized traces;

comprising
a flat core formed of a material that is thermally and electrically conductive;
a first ceramic layer disposed on said core and having a cavity formed therein in which said die lies on said core with the first ceramic layer surrounding said cavity;
a plurality of metallized feed-throughs formed on an upper surface of said first ceramic layer, each feed-through extending to an inner metallized pad adjacent said cavity;
a second ceramic layer disposed on the upper surface of said first ceramic layer and encircling said cavity and covering said metallized feed-throughs but leaving said inner pads available for bonding to said die;
outer metallized pads on a lower surface of said first ceramic layer for connecting electrically onto the metallized traces of said printed circuit board;
and
conductor means within said first ceramic layer connecting said outer metallized pads to respective ones of said feed-throughs;
and wherein said core has one or more peripheral access portions that permit access to the lower surface of said first ceramic layer at locations of said outer pads to permit the outer pads to be connected directly to the printed circuit board metal traces.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/005,703Filed 3 Dec 2001
Published: US 2003/0111714 A119 Jun 2003
Granted: 21 Oct 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

H05K 1/0243
High frequency adaptations: printed circuits associated with mounted high frequency components
H10W 44/20
Electrical arrangements for controlling or matching impedance: at high-frequency [HF] or radio frequency [RF]
H05K 1/182
Structurally associated with non-printed electric components: associated with components mounted in printed circuit boards [PCB], e.g.…
H05K 3/0061
Laminating printed circuit boards onto other substrates, e.g. metallic substrates: onto a metallic substrate, e.g. a heat sink