Molded electronic component

A molded electronic component comprising:

• electronic circuitry;
• a housing of a molded material that encases said electronic circuitry and that has a top surface, a bottom surface, opposite first and second side surfaces, and opposite third and fourth side surfaces forming a primarily rectangular block shape;
• and
• plural electrical connection pins extending from said electronic circuitry out of said housing, outwardly from said first side surface along a single pin plane;
• wherein said housing further has a ridge of said molded material protruding outwardly from at least said third and fourth side surfaces along said pin plane, and a groove recessed inwardly into at least a portion of said second side surface along said pin plane.

A combination of a frame and a molded electronic component, comprising:

• electronic circuitry;
• a housing of a molded material that encases said electronic circuitry and that has a top surface, a bottom surface, opposite first and second side surfaces, and opposite third and fourth side surfaces forming a primarily rectangular block shape;
• and
• plural electrical connection pins extending from said electronic circuitry out of said housing, outwardly from said first side surface alone a single pin plane;
• wherein said housing further has a ridge of said molded material protruding outwardly from at least said third and fourth side surfaces along said pin plane, and a groove recessed inwardly into at least a portion of said second side surface along said pin plane;
• wherein said frame is interconnected with said connection pins and extends around said first, second, third and fourth side surfaces;
• and
• wherein said frame is spaced away from said third and fourth side surfaces, said ridge protrudes outwardly to said frame at said third and fourth side surfaces, and said frame has at least a widened portion at said second side surface, whereby said widened portion protrudes into said groove in said second side surface of said housing.