IC chip package
AssigneeTaiwan Electronic Packaging Co., Ltd.
InventorCheng-Chiao Wu
Life of this patent
Estimating the term…
Abstract
An IC chip package is constructed to comprise a substrate, a chip, adhesive means, and a cover. The substrate comprises a top side and a receiving chamber, the receiving chamber having an opening disposed in the top side. The top side of the substrate is provided with a plurality of connecting pads arranged around the opening of the receiving chamber. The chip is fixedly mounted in the receiving chamber and is provided with a plurality of connecting pads respectively electrically connected to the connecting pads of the substrate by means of bonding wires. The adhesive means is applied on the connecting area between the bonding wires and the connecting pads of the substrate. The cover is fixedly fastened to the adhesive means to close the opening of the receiving chamber.
Claims19
An IC chip packaging comprising:
- a substrate having a top side, a bottom side, a side wall around the periphery of the bottom side extending up in a straight line between the bottom side and the top side, and a receiving chamber formed by the side wall and the bottom side having a uniform cross section between the bottom side and the top side of the substrate, said receiving chamber having an opening disposed in the top side of said substrate, the top side of said substrate having a plurality of connecting pads arranged around the opening of said receiving chamber;
- a chip mounted in said receiving chamber of said substrate adjacent to the side wall so as to produce a space between the chip and the side wall smaller than that necessary to permit movement therein of a wire bonding tool and having a plurality of connecting pads on the top side of the chip;
- a plurality of bonding wires respectively electrically connected between the connecting pads on the top side of said substrate and the connecting pads on said chip;
- adhesive means applied on a connecting area between said bonding wires and the connecting pads of said substrate;
- and
- a cover fixedly fastened to said adhesive means to close the opening of said receiving chamber.
An IC chip packaging comprising:
- a substrate having a top side, a bottom side, a side wall around the periphery of the bottom, side, and a receiving chamber formed by the side wall and the bottom side, said receiving chamber having an opening disposed on the top side of said substrate, the top side of said substrate having a plurality of connecting pads arranged around the opening of said receiving chamber;
- a chip mounted in said receiving chamber of said substrate and having a plurality of connecting pads on a top side of the ship;
- a plurality of bonding wires respectively electrically connected between the connecting pads on the cop side of said substrate and the connecting pads on said chip;
- adhesive means applied on a connecting area between said bonding wires and the connecting pads of said substrate;
- and
- a cover fixedly fastened to said adhesive means to close the opening of said receiving chamber.
Dependencies are inferred from the claim text.