Multi-functional fiber optic coupler

An optoelectronic assembly comprising:

• a substrate, a plurality of holes within said substrate parallel to a facial surface of said substrate and opening to a side surface of said substrate;
• a plurality of optical transmission elements in said plurality of holes, respectively;
• an optical chip including a plurality of optical devices, said optical chip being bonded to said side surface of said substrate such that said plurality of optical devices of said optical chip are aligned with the plurality of optical transmission elements, respectively;
• and wherein
• said substrate comprises two planar sections, said planar sections having a plurality of grooves on adjacent facial surfaces, said adjacent facial surfaces being bonded to each other such that the plurality of grooves of one of said sections is aligned with the plurality of grooves of the other of said sections to form said plurality of holes in said substrate.

An optoelectronic assembly comprising:

• a substrate, a plurality of holes within said substrate parallel to a facial surface of said substrate and opening to a side surface of said substrate, a first set of conductive pads on said facial surface, a first set of conductors formed on or integral with said substrate, said first set of conductors interconnecting said first set of conductive pads to circuitry on said substrate;
• a plurality of optical transmission elements in said plurality of holes, respectively;
• an optical chip including a plurality of optical devices, said optical chip being bonded to said side surface of said substrate such that said plurality of optical devices are aligned with a respective plurality of said optical transmission elements;
• and
• a planar printed circuit board having a second set of conductive pads on a facial surface of said printed circuit board, said printed circuit board including circuitry electrically connected to said second set of conductive pads, said first set of conductive pads of said substrate being solderd to said second set of conductive pads of said printed circuit board.