Laser machining method for precision machining
AssigneeSeiko Epson Corporation
InventorsJun Amako, Masami Murai, Tsutomu Ota, Tomio Sonehara
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AssigneeSeiko Epson Corporation
InventorsJun Amako, Masami Murai, Tsutomu Ota, Tomio Sonehara
Estimating the term…
A laser machining method and apparatus performs high-speed and high-precision machining on a thin film and a liquid crystal panel. The apparatus includes: a plurality of pulse laser generators, drivers for alternately driving a plurality of pulse laser generators to generate laser beams delayed in phase between each other; collimators for making the generated laser beams equal in quality; a wave plate for converting the laser beams into elliptically polarized laser beams; and a phase grating for dividing each laser beam emitted by each of the plurality of laser beam generators into a plurality of laser beams; such that an object to be processed is selectively illuminated with the plurality of laser beams produced by the phase grating. The phase grating has structure on its surface for dividing each of the laser beams into equal intensity beams. Open grooves are formed having uniform shape and quality.
A method of laser machining comprising the steps of:
A method of fabricating a liquid crystal panel including a film on a substrate, said film having grooves produced thereon, said method comprising the steps of:
A method of fabricating a liquid crystal panel including a film on a substrate, said method comprising the steps of:
Dependencies are inferred from the claim text.