Method of controlling crystallographic orientation in laser-annealed polycrystalline silicon films
AssigneeSharp Laboratories of America, Inc.
InventorApostolos Voutsas
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Abstract
A method is provided to produce thin polycrystalline films having a single predominant crystal orientation. The method is well suited to the production of films for use in production of thin film transistors (TFTs). A layer of amorphous silicon is deposited over a substrate to a thickness suitable for producing a desired crystal orientation. Lateral-seeded excimer laser annealing (LS-ELA) is used to crystallize the amorphous silicon to form a film with a preferred crystal orientation. The crystallized film is then polished to a desired thickness for subsequent processing.
Claims6
A method of forming polycrystalline films on a substrate comprising the steps of:
- a) providing a substrate;
- b) depositing an amorphous silicon film on the substrate to a thickness of at least 100 nm;
- c) annealing the amorphous silicon film using a lateral crystallization process comprising a sequence of laser pulses projected through a mask having a narrow slit to project a beamlet onto the surface of the amorphous silicon film to crystallize the amorphous silicon film as the beamlet is advanced over the surface of the amorphous silicon film between successive laser pulses to produce a polycrystalline film having a predominantly <100> crystallographic orientation in the rolling direction;
- and
- d) polishing the polycrystalline film to a thickness of less than 60 nm to prepare the film for further processing.
Dependencies are inferred from the claim text.