Method of making backside buried strap for SOI DRAM trench capacitor
AssigneeInternational Business Machines Corporation
InventorsJack A. Mandelman, Herbert L. Ho
Life of this patent
Estimating the term…
Abstract
In SOI integrated circuits having trench capacitor DRAM arrays, the decreasing thickness of the insulating layer causes cross-talk between the passing wordline traveling over the trench capacitor. Increasing the depth of the recess at the top of the trench and undercutting the insulating layer laterally permits the buried strap from the capacitor center electrode to make contact to the back side of the SOI layer, thereby increasing the vertical separation between the passing wordline and the strap.
Claims9
A method of making an integrated circuit having a device layer of semiconductor with a device layer thickness of less than 100 nm above an array insulating layer and containing an array of DRAM cells disposed in a first subset of DRAM cells and a second subset of DRAM cells, including a trench capacitor formed at an edge of said DRAM cells and connected by a buried strap to a horizontal pass transistor formed in said device layer and displaced laterally from said trench capacitor, comprising the steps of:
- forming said set of trench capacitors by etching trenches through said device layer and array insulating layer and depositing center electrodes insulated by a capacitor insulator;
- recessing said center electrodes below a bottom surface of said device layer;
- etching laterally into said array insulating layer outside said trenches, thereby exposing a contact area on said bottom surface of said device layer;
- depositing strap conductive material in said trenches to a level above said bottom surface of said device layer, whereby said strap conductive material makes electrical contact with said bottom surface to form said buried straps;
- depositing top insulating material having a top insulator thickness extending up to a surface of said device layer in said trenches above said strap conductive material, whereby said top insulator thickness is approximately equal to said device layer thickness;
- and
- forming a set of isolating trenches by removing said device layer and said array insulating layer outside said trenches and said cell pass transistors, to a depth of at least said bottom of said buried straps, whereby only that portion of said buried strap inside said trenches and underneath said transistors remains and said buried straps are isolated from corresponding buried straps in adjacent cells by said isolating trenches;
- forming a set of horizontal cell pass transistors in said device layer having cell electrodes, transistor gates disposed above said device layer and connected to a first subset of interconnect lines and internal electrodes in contact with said buried straps through said contact area and separated from an adjacent trench by said isolating trenches.
A method of making an integrated circuit having a device layer of semiconductor with a device layer thickness of less than 100 nm above an array insulating layer and containing an array of DRAM cells disposed in a first subset of DRAM cells and a second subset of DRAM cells, including a trench capacitor formed at an edge of said DRAM cells and connected by a buried strap to a horizontal pass transistor formed in said device layer and displaced laterally from said trench capacitor, said array of DRAM cells having at least some pairs of cells having a trench capacitor in a first cell separated by a portion of material from a corresponding trench capacitor in an adjacent cell, comprising the steps of:
- forming said set of trench capacitors by etching trenches through said device layer and array insulating layer and depositing center electrodes insulated by a capacitor insulator;
- recessing said center electrodes below a bottom surface of said device layer;
- etching laterally into said array insulating layer outside said trenches, thereby exposing a contact area on said bottom surface of said device layer;
- depositing a conformal liner of conductive material in said trenches to a level above said bottom surface of said device layer, whereby said liner of conductive material makes electrical contact with said bottom surface at the location where said buried strap meets said buried surface;
- depositing strap conductive material in said trenches to a level above said bottom surface of said device layer, whereby said strap conductive material makes electrical contact with said bottom surface to form said buried straps;
- depositing top insulating material having a top insulator thickness extending up to a surface of said device layer in said trenches above said strap conductive material, whereby said top insulator thickness is approximately equal to said device layer thickness;
- and
- forming a set of isolating trenches by removing said device layer and said array insulating layer outside said trenches and said cell pass transistors, to a depth of at least said bottom of said buried straps and filling said isolating trenches with an isolating material, whereby only that portion of said buried strap inside said trenches and underneath said transistors remains and said buried straps are isolated from corresponding buried straps in adjacent cells by said isolating material, and whereby said pairs of cells having a trench capacitor in a first cell separated by a portion of material from a corresponding trench capacitor in an adjacent cell are separated by said isolating material, so that the space available for passing wordlines comprises top insulators in said pairs of cells and said isolating trench;
- forming a set of horizontal cell pass transistors in said device layer having cell electrodes, transistor gates disposed above said device layer and connected to a first subset of interconnect lines and internal electrodes in contact with said buried straps through said contact area and separated from an adjacent trench by said isolating trenches.
Dependencies are inferred from the claim text.