Compliant package with conductive elastomeric posts

A method of manufacturing an assembly comprising:

• providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface;
• providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface;
• forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the second microelectronic element;
• and
• after the forming a plurality of conductive elastomeric posts, injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.

A method of making an assembly comprising:

• providing a first microelectronic element having a first surface, a plurality of contacts exposed at the first surface, and a conductive elastomeric material disposed on each of the contacts of the first microelectronic element;
• providing a second microelectronic element having a top surface and a plurality on contacts expose at the top surface;
• juxtaposing the first surface of the first microelectronic element and the top surface of the second microelectronic element so that each of the contacts of the first microelectronic element is aligned with one of the contacts of the second microelectronic element;
• curing the conductive elastomeric material to form a plurality of conductive elastomeric posts, wherein each of the contacts of the first microelectronic element is connected to one of the contacts of the second microelectronic element by one of the conductive elastomeric posts;
• and
• after the curing the conductive elastomeric material to form a plurality of conductive elastomeric posts, injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.