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US 6,635,511 B2Granted
Integrated ball grid array-pin grid array-flex circuit interposing probe assembly
AssigneeAgilent Technologies, Inc.
InventorBrent A. Holcombe
Life of this patent
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Abstract
The method of the invention comprises the steps of soldering a BGA socket onto a PGA header, inserting a flex assembly onto the BGA-PGA assembly, placing solder preforms over the PGA pins and then reflowing the flex assembly to the BGA-PGA assembly.
Claims12
A method of constructing a Ball-Grid-Array-Pin-Grid-Array-Flex (BGA-PGA-Flex) probe comprising the steps of:
- soldering a Ball Grid-Array (BGA) socket onto a Pin-Grid-Array (PGA) header to form a BGA-PGA assembly;
- testing the BGA-PGA assembly for continuity;
- inserting a flex assembly onto the BGA-PGA assembly;
- placing solder preforms over each PGA pin;
- and
- using a localized heat source to reflow the flex assembly to the BGA-PGA assembly.
3 more elements
Dependencies are inferred from the claim text.