Infrared detecting element, infrared two-dimensional image sensor, and method of manufacturing the same
AssigneesMatsushita Electric Industrial Co., Ltd., Hochiki Corporation, Murata Manufacturing Co., Ltd., Masanori Okuyama
InventorsKazuhiko Hashimoto, Tomonori Mukaigawa, Ryuichi Kubo, Hiroyuki Kishihara, Minoru Noda, Masanori Okuyama
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Abstract
An infrared detecting capacitor formed of a ferroelectric film has its capacitor portion supported by first and second interconnecting lines to be held on an Si substrate located on both sides of a trench. A lower electrode is coupled with the first interconnecting line while an upper electrode is coupled with the second interconnecting line. The capacitor portion is a rectangle in shape in plan view without small triangular sections opposite to each other in the diagonal direction.
Claims8
A method of manufacturing an infrared detecting element comprising the steps of:
- forming on a main surface of a substrate a first interconnecting line and a lower electrode metal layer;
- forming a ferroelectric layer on said lower electrode metal layer;
- depositing a first insulating film of silicon oxide on said ferroelectric layer;
- forming on said first insulating film an upper electrode metal layer and a second interconnecting line;
- anisotropically wet etching said substrate beneath said lower electrode metal layer from said main surface of said substrate to form a trench such that said lower electrode metal layer, said ferroeletric layer and said upper electrode metal layer are supported by said first and second interconnecting lines.
A method of manufacturing an infrared detecting element comprising the steps of:
- forming an MgO film on a main surface of a substrate;
- forming on said MgO film a first interconnecting line and a lower electrode metal layer;
- forming a ferroelectric layer on said lower electrode metal layer;
- forming on said ferroelectric layer an upper electrode metal layer and a second interconnecting line;
- and
- anisotropically wet etching said substrate beneath said lower electrode metal layer from said main surface of said substrate to form a trench such that said lower electrode metal layer, said ferroelectric layer and said upper electrode metal layer are supported by said first and second interconnecting lines.
A method of manufacturing an infrared detecting element comprising the steps of:
- depositing a first insulating film on a main surface of a substrate and patterning said first insulating film into a shape including a predetermined shape in plan view;
- anisotropically wet etching said substrate beneath said predetermined shape of said first insulating film from said main surface of said substrate to form a trench such that said predetermined shape constitutes a membrane supported with respect to the main surface of said substrate;
- forming a first interconnecting line and a lower electrode metal layer for said membrane;
- forming a ferroelectric layer on said lower electrode metal layer;
- depositing a second insulating film of silicon oxide on said ferroelectric layer;
- and
- forming on said second insulating film an upper electrode metal layer and a second interconnecting line.
A method of manufacturing an infrared detecting element comprising the steps of:
- depositing a first insulating film on a main surface of a substrate;
- forming an MgO film on said first insulating film and patterning said first insulating film and said MgO film into a shape including a predetermined shape in plan view;
- anisotropically wet etching said substrate beneath said predetermined shape of said first insulating film from said main surface of said substrate to form a trench such that said predetermined shape constitutes a membrane supported with respect to the main surface of said substrate;
- forming a first interconnecting line and a lower electrode metal layer on said membrane;
- forming a ferroelectric layer on said lower electrode metal layer;
- and
- forming on said ferroelectric layer an upper electrode metal layer and a second interconnecting line.
Dependencies are inferred from the claim text.