Falling film plasma reactor
AssigneeRobert R. Moore
InventorsRobert R. Moore, James D. Getty
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Abstract
A falling film plasma reactor (FFPR) provides a number of benefits for the treatment of process gases. The falling film plasma reactor uses high voltage alternating current or pulsed direct current which is applied to radially separated electrodes to thereby create a dielectric breakdown of the process gas that is flowing within the large radial gap between the two electrodes. Typical plasma reactors often utilize fixed dielectric construction which can result in potential failure of the device by arcing between the electrodes as portions of the dielectric fail. Such failures are prevented by using a dielectric liquid that constantly flows over the electrodes, or over a fixed dielectric barrier over the electrodes.
Claims7
A falling film plasma reactor using high voltage alternating current or pulsed direct current applied to radially spaced cylindrical electrodes to generate dielectric breakdown of a process gas within a large radial gap comprising a first inner electrode having an outer surface, a second outer electrode having an inner surface, and a liquid dielectric, wherein said liquid dielectric is configured to flow as a film over said outer surface of said first inner electrode, and said liquid dielectric is configured to flow as a film over said inner surface of said second outer electrode.
A falling film plasma reactor comprising radially spaced cylindrical electrodes, a liquid dielectric configured to prevent arcing between the electrodes and a large radial gap between the electrodes configured to allow the liquid dielectric to flow over at least one of said electrodes, and further configured to allow a process gas to contact, said liquid dielectric flowing over at least one of said electrodes.
Dependencies are inferred from the claim text.