Reinforced polishing pad for linear chemical mechanical polishing and method for forming

A method for fabricating a polishing pad in a continuous loop reinforced by a reinforcing filler comprising the steps of:

• providing a die having a cavity in the shape of a continuous loop defined by an inner die face and an outer die face;
• applying a reinforcing filler having an aspect ratio of at least 10 on said inner die face, said filler being oriented substantially in a circumferential direction of said continuous loop;
• filling said cavity partially with a polymeric material to encapsulate said reinforcing filler in a direction parallel to said circumferential direction of said continous loop to form a sub-layer of said polishing pad, said sub-layer containing at least 10% by weight of said reinforcing filler;
• and
• filling said cavity completely with said polymeric material laminating to said sub-layer to form said continuous loop polishing pad.