Chemical mechanical planarization or polishing pad with sections having varied groove patterns

A chemical mechanical planarization system for chemical mechanical planarization of semiconductor wafers, the system comprising:

• a wafer polisher;
• a polishing pad associated with the wafer polisher, the polishing pad having at least two serially linked polishing pad sections wherein each of the polishing pad sections are arranged sequentially along an intended direction of motion of the polishing pad, the polishing pad sections comprising:
• a first polishing pad section having a first groove pattern formed in a side of the first polishing pad section adapted to contact a semiconductor wafer, wherein the first groove pattern comprises a first plurality of grooves;
• and
• a second polishing pad section having a second plurality of grooves in a side of the second polishing pad section adapted to contact the semiconductor wafer, wherein the first groove pattern differs from the second groove pattern;
• and
• a wafer holder configured to hold the semiconductor wafer against the polishing pad.