Loading patent…
AssigneesEbara Corporation, Kabushiki Kaisha Toshiba
InventorsKoji Ono, Shozo Oguri, Kenichi Sasabe, Masato Kurita, Yasuhisa Kojima, Tadanori Egawa, Kenichi Shigeta
Estimating the term…
Disclosed is a polishing apparatus that comprises a polishing tool, a substrate holding member, a measuring device to measure a drive current of a drive unit while the drive unit drives at least one of the polishing tool and the substrate holding member, and a failure detection unit to detect either jumping of the substrate from the substrate member or breakage of the substrate. While a substrate is held by a substrate holding member and pressed against the polishing tool during a polishing operation, the failure detection unit will detect jumping of the substrate from the substrate holding member or breakage of the substrate based on a comparison of the value of the drive current with a threshold value, or a comparison of a waveform pattern of the drive current with a predetermined waveform pattern.
A polishing apparatus comprising:
A polishing apparatus comprising:
A polishing apparatus comprising:
Dependencies are inferred from the claim text.