Solder ball delivery and reflow method
AssigneeKulicke & Soffa Investments, Inc.
InventorsEli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh
Life of this patent
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Abstract
An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.
Claims12
A method of delivering solder material onto a substrate, the method comprising the steps of:
- (a) transferring the solder material from a first reservoir to a second reservoir;
- (b) agitating the solder material in the second reservoir with a pressurized fluid;
- (c) directing the agitated solder material into a column;
- (d) individually indexing the solder material from the column into a capillary;
- and
- (e) directing the individual solder material through the capillary to the substrate.
A method of delivering solder material onto a substrate, the method comprising the steps of:
- (a) agitating the solder material held in a plurality of agitation zones by a pressurized fluid;
- (b) directing the agitated solder material from the plurality of agitation zones into a respective plurality of columns;
- (c) individually indexing ones of the solder material from the plurality of columns into a respective plurality of capillaries;
- and
- (d) directing the individual ones of the solder material through the plurality of capillaries to the substrate.
Dependencies are inferred from the claim text.