Method of forming metallic z-interconnects for laminate chip packages and boards
AssigneeInternational Business Machines Corporation
InventorsBrian E. Curcio, Donald S. Farquhar, Elizabeth F. Foster, Amit K. Sarkhel
Life of this patent
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Abstract
Deterioration and damage to insulator materials in an interconnection structure having vertical connections due to exposure to heat during bonding of lamina is avoided by performing diffusion bonding of metal pads at plated through holes (PTH) at temperatures below the melting points of conductive material in the bond. Diffusion bonding is achieved during time periods required for processing (e.g. curing or drying) of insulating materials in the laminated structure.
Claims17
A process for joining substrates, comprising the steps of:
- providing a first substrate having first circuitized features of electrically conductive material on an external surface thereof;
- providing a second substrate of an electrically conductive material on an external surface thereof wherein at least some areas of said conductive material are located in a mirror image pattern to said first circuitized features;
- depositing a joining material on at least a portion of at least one of said first and second circuitized features;
- thereafter positioning said second substrate adjacent said first substrate with at least some of said second circuitized features or said joining material thereon in direct mechanical contact with said first circuitized features or said joining material thereon;
- and
- applying pressure and heat to said first and second substrates to laminate together said substrates and provide a diffusion bond between said at least some of said second circuitized features and said first circuitized features, said heat producing a temperature below a melting point of said joining material or said circuitized features.
A method of forming a multi-layer connection structure having vertical connections between conductive areas on surfaces of respective lamina, said method comprising steps of
- applying joining material to portions of said conductive areas of at least one lamina,
- positioning at least two lamina with at least some of said conductive areas in registration with some of said conductive areas on another lamina, and
- diffusing at least one of said joining material and material of said conductive areas into the other at a temperature below the melting point of either said joining material or said material of said patterned conductive features.
A multi-layer connection structure having vertical connections between respective lamina, said vertical connections comprising
- patterned conductive features on facing surfaces of respective lamina, and
- a region at an interface of said patterned conductive feature in which material of said patterned conductive features and a joining material are interdiffused without solution of either in the other to form a diffusion bond.
Dependencies are inferred from the claim text.