Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
AssigneeMicron Technology, Inc.
InventorsSven Evers, Craig T. Clyne
Life of this patent
Estimating the term…
Abstract
A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
Claims29
An adjustable clamping apparatus in a leadframe clamp for clamping a portion of a leadframe in a leadframe strip, comprising:
- a lower clamping surface for supporting at least a portion of said leadframe;
- an upper clamping member comprising a wirebonding window frame having a window therein for movement when subjected to a force engaging portions of said leadframe;
- and
- a resilient member located substantially above a portion of said upper clamping member, said resilient member compressible by said upper clamping member for substantially causing said wirebonding window frame to engage portions of said leadframe located under said wirebonding window frame.
A leveling clamping apparatus in a leadframe clamp for clamping a portion of a leadframe of a leadframe strip, comprising:
- an apparatus for allowing movement of a clamp insert of said leveling clamping apparatus relative to a clamp holder of said leveling clamping apparatus;
- a polymeric member located substantially above a portion of said clamp insert biasing said clamp insert against said leadframe;
- and
- an apparatus for retaining said polymeric member in a position for biasing said clamp insert against said leadframe.
A leveling clamp apparatus in a leadframe clamp for clamping a portion of a leadframe in a leadframe strip, comprising:
- a lower clamping surface for supporting at least a portion of said leadframe;
- an upper clamping member having a peripheral wirebonding window frame for movement under a force for engaging portions of said leadframe underlying said peripheral wirebonding window frame;
- and
- a polymeric member located substantially above a portion of said upper clamping member, said polymeric member compressible by said upper clamping member for causing said peripheral wirebonding window frame to engage said portions of said leadframe.
A leveling clamping apparatus in a leadframe clamp for clamping portions of a leadframe of a leadframe strip, said leveling clamping apparatus comprising:
- apparatus for providing movement of a clamp insert of said leveling clamping apparatus relative to a clamp holder of said leveling clamping apparatus;
- a resilient polymeric member located substantially above a portion of said clamp insert for biasing said clamp insert against said leadframe;
- and
- a retaining apparatus for retaining said resilient polymeric member in a biasing position.
A leveling clamping apparatus in a leadframe clamp for clamping portions of a leadframe of a leadframe strip, said leveling clamping apparatus comprising:
- an apparatus for providing movement of a clamp insert of said leveling clamping apparatus relative to a clamp holder of said leveling clamping apparatus, said clamp insert having a range of movement of approximately 0.0002 inch to approximately 0.01 inch for self-leveling of said clamp insert against at least a portion of said leadframe;
- a resilient biasing member for biasing said clamp insert against said at least a portion of said leadframe;
- and
- a retaining apparatus for retaining said resilient biasing member in a biasing position for biasing said clamp insert against said at least a portion of said leadframe.
Dependencies are inferred from the claim text.