US 6,634,370 B2Granted

Liquid treatment system and liquid treatment method

AssigneeTokyo Electron Limited

InventorsSatoshi Nakashima, Wataru Okase, Takenobu Matsuo, Tameyasu Hyakuzuka, Yasushi Yagi, Yoshiyuki Harima, Jun Yamauchi, Hiroki Taniyama, Kyungho Park, Yoshitsugu Tanaka, Yoshinori Kato, Hiroshi Sato

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Abstract

Liquid treatment units are disposed in multi-tiers surrounding a main-arm 35. Among liquid treatment units, plating units M1 through M4 are disposed on a lower tier side, and a unit for post-treatment process such as a cleaning unit 70 where a cleaner atmosphere is necessary is disposed on an upper tier side. Thereby, an improvement in an area efficiency and the formation and maintenance of a clean atmosphere can be simultaneously obtained.

Claims11

Dependent claims

A liquid treatment system, comprising:

a plating unit constructed and arranged to plate a substrate with a plating solution containing a metal ion;
a cleaning unit constructed and arranged to clean the plated substrate, said cleaning unit being disposed above the plating unit;
a first gas feed constructed and arranged to feed a cleansed gas flowing from the cleaning unit to the plating unit in the liquid treatment system;
and
a first transfer unit constructed and arranged to transfer the substrate in a vertical direction between the plating unit and the cleaning unit.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/849,276Filed 7 May 2001
Priority: JP P2000-1744388 May 2000
Published: US 2001/0037764 A18 Nov 2001
Granted: 21 Oct 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10P 72/0454
Characterised by the layout of the process chambers: surrounding a central transfer chamber
C25D 17/001
Constructional parts, or assemblies thereof, of cells for electrolytic coating: apparatus specially adapted for electrolytic coating of wafers,…
H10P 72/0458
Characterised by the layout of the process chambers: vertical arrangement
H10P 72/0476
Comprising a chamber adapted to a particular process: comprising at least one plating chamber