Application of ozonated DI water to scrubbers for resist strip and particle removal processes
AssigneeTexas Instruments Incorporated
InventorsClaire Ching-Shan Jung, Neal T. Murphy
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Abstract
A method for resist strip and particle removal. Wafers (108) with a patterned resist formed thereon are placed on a wafer chuck (104) in a scrubber tool (100,200). Ozonated deionized water (112) is applied to the surface of wafer (108). The ozonated deionized water (112) strips the resist and removes the resist residue without the use of hazardous chemicals. Particle removal is accomplished in the same tool (100,200). The ozonated deionized water (112) is formed in a closed canister (114). Deionized water is circulated through the canister (114) and ozone is added to the deionized water at a premixer (118).
Claims10
A method for fabricating an integrated circuit, comprising the steps of:
- providing a semiconductor wafer with a resist pattern formed thereon;
- placing said semiconductor wafer on a wafer chuck in a scrubber;
- applying an ozonated deionized water to a surface of said wafer to remove said resist pattern, while said wafer is on said wafer chuck in the scrubber.
Dependencies are inferred from the claim text.