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US 6,634,100 B2Granted
Interposer and methods for fabricating same
AssigneeMicron Technology, Inc.
InventorsSalman Akram, Alan G. Wood, Warren M. Farnworth
Life of this patent
Estimating the term…
Abstract
Methods for fabricating an interposer, wherein the fence include the use of stereolithographic and molding processes. When stereolithography is used to fabricate the fence, a machine vision system that includes at least one camera operably associated with a computer may be used to control a stereolithography apparatus and facilitates recognition of the position and orientation of interposer substrates on and around which material is to be applied in one or more layers to form the fence. As a result, the interposer substrates need not be precisely mechanically aligned.
Claims29
A method for fabricating an interposer, comprising:
- providing at least one interposer substrate having a top surface with top contact pads exposed thereto and a bottom surface, each of said top contact pads communicating with a corresponding conductive structure configured to communicate with test equipment, said top contact pads being arranged correspondingly to discrete conductive elements protruding from at least one semiconductor device to be assembled with said at least one interposer substrate;
- and
- fabricating at least one fence configured for placement on said top surface, said at least one fence including a receptacle for exposing said top contact pads, said receptacle configured to receive said at least one semiconductor device so as to align said discrete conductive elements with corresponding ones of said top contact pads of said at least one interposer substrate, said fabricating including:
- forming a layer comprising unconsolidated material;
- at least partially consolidating selected regions of said layer to form a first layer of said at least one fence;
- and
- repeating said forming and said at least partially consolidating at least once to form at least one additional layer of said at least one fence.
4 more elements
A method for fabricating an interposer, comprising:
- providing at least one interposer substrate having a top surface with top contact pads exposed thereto and a bottom surface, each of said top contact pads communicating with a corresponding conductive structure configured to communicate with test equipment, said top contact pads being arranged correspondingly to discrete conductive elements protruding from at least one semiconductor device to be assembled with said at least one interposer substrate;
- and
- fabricating at least one fence configured for placement on said top surface, said at least one fence including a receptacle for exposing said top contact pads, said receptacle configured to receive said at least one semiconductor device so as to align said discrete conductive elements with corresponding ones of said top contact pads of said at least one interposer substrate, said fabricating including:
- placing said at least one interposer substrate in a first orientation;
- determining an envelope defining limits of inner and outer surfaces of said at least one fence;
- and
- forming at least a portion of said at least one fence as a series of superimposed, contiguous, mutually adhered layers of material commencing at a defined limit of said at least one fence.
4 more elements
A method for fabricating an interposer, comprising:
- providing at least one interposer substrate having a top surface with top contact pads exposed thereto and a bottom surface, each of said top contact pads communicating with a corresponding conductive structure configured to communicate with test equipment, said top contact pads being arranged correspondingly to discrete conductive elements protruding from at least one semiconductor device to be assembled with said at least one interposer substrate;
- and
- fabricating at least one fence configured for placement on said top surface, said at least one fence including a receptacle for exposing said top contact pads, said receptacle configured to receive said at least one semiconductor device so as to align said discrete conductive elements with corresponding ones of said top contact pads of said at least one interposer substrate, said fabricating including:
- forming a layer comprising unconsolidated material;
- directing a focused beam of radiation onto a surface of said layer at selected regions thereof to at least partially consolidate material in said selected regions of said layer so as to form a first layer of said at least one fence;
- and
- repeating said forming and said at least partially consolidating at least once to form at least one additional layer of said at least one fence.
4 more elements
Dependencies are inferred from the claim text.