Methods for assembling, modifying and manufacturing a vertical surface mount package
AssigneeMicron Technology, Inc.
InventorsLarry D. Kinsman, Walter L. Moden, Warren M. Farnworth
Life of this patent
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Abstract
A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.
Claims10
A method for manufacturing a vertical surface mount package, comprising:
- connecting a plurality of leads of the vertical surface mount package to a semiconductor device, each lead of said plurality of leads of the vertical surface mount package extending from said semiconductor device substantially parallel to every other lead of said plurality of leads of the vertical surface mount package, in substantially a same direction from said semiconductor device as every other lead of said plurality of leads, such that each lead of said plurality of leads extends from a single peripheral edge of said semiconductor device to be positioned adjacent to a bottom peripheral edge of the vertical surface mount package substantially parallel to a plane of said semiconductor device and non-parallel to a plane of a carrier upon orientation of the vertical surface mount package relative to the carrier;
- enclosing said semiconductor device within a cover including the bottom peripheral edge such that each of said plurality of leads extends from the bottom peripheral edge;
- and
- trimming said plurality of leads substantially parallel to the bottom peripheral edge to form a plurality of substantially non-deformed stub contacts.
A method for assembling a vertical surface mount package, comprising:
- electrically connecting a plurality of leads of the vertical surface mount package to bond pads of a semiconductor device, each lead of said plurality of leads of the vertical surface mount package extending from said semiconductor device substantially parallel to every other lead of said plurality of leads, such that each lead of said plurality of leads extends out from a bottom peripheral edge of the vertical surface mount package, in substantially a same direction from said vertical mount package as every other lead of said plurality of leads, substantially parallel to a plane of said semiconductor device, and in a direction non-parallel to a plane of a carrier upon orientation of the vertical surface mount package relative to the carrier;
- encapsulating at least an active surface of said semiconductor device and a proximate region of said plurality of leads;
- and
- trimming said plurality of leads close to the bottom peripheral edge of the vertical surface mount package, and substantially parallel to the bottom peripheral edge to form a plurality of substantially non-deformed stub contacts.
Dependencies are inferred from the claim text.