Apparatus for mounting a land grid array module
AssigneeInternational Business Machines Corporation
InventorsJohn L. Colbert, John S. Corbin, Jr., Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha, Charles C. Stratton
Life of this patent
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Abstract
An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
Claims13
An installation apparatus for mounting a land grid array (LGA) module having an upper and a lower surface thereof on a printed wiring board (PWB) having a front and a back surface thereof, the apparatus comprising:
- a frame member surrounding an LGA socket site, the frame having a back side adapted for fixed attachment to the PWB and a front side adapted for receiving at least one module holding member;
- and
- at least one module holding member fixedly attached to the frame for retention therewith regardless of whether there is an LGA multi-chip module in the LGA socket site or not, and for rotation about an axis from a first to a second angular position of the module holding member with respect to the frame, the module holding member having a lower surface thereof defining an inclined plane adapted for contacting the upper surface of an LGA multi-chip module located in the LGA socket site;
- the inclined plane of the module holding member exerting a progressively increasing clamping force against the upper surface the LGA multi-chip module for retaining the LGA multi-chip module in the LGA socket site of the frame member as the module holding member is rotated in one direction about the axis from the first to the second angular position of the module holding member, and exerting a progressively decreasing clamping force against the upper surface the LGA multi-chip module for releasing the LGA multi-chip module from the LGA socket site of the frame member as the module holding member is rotated in the other direction about the axis from the second to the first angular position of the module holding member.
An installation apparatus for mounting a land grid array (LGA) multi-chip module having an upper and a lower surface thereof on a printed wiring board (PWB) having a front and a back surface thereof, the apparatus comprising:
- module mounting means defining an LGA socket site, and adapted for fixed attachment to the PWB;and
- at least one module holding member fixedly attached to the module mounting means for retention therewith regardless of whether there is an LGA multi-chip module in the LGA socket site or not, and for rotation about an axis from a first to a second angular position of the module holding member;
- the module holding member having a lower surface thereof defining an inclined plane adapted for contacting the upper surface of an LGA multi-chip module located in the LGA socket site;
- the inclined plane of the module holding member exerting a progressively increasing clamping force against the upper surface of an LGA multi-chip module in the LGA socket site for retaining the LGA multi-chip module in the LGA socket site as the module holding member is rotated in one direction about the axis from the first to the second angular position of the module holding member, and exerting a progressively decreasing clamping force against the upper surface the LGA multi-chip module for releasing the LGA multi-chip module from the LGA socket site of the frame member as the module holding member is rotated in the other direction about the axis from the second to the first angular position of the module holding member.
Dependencies are inferred from the claim text.