Opto-electronic multi-chip modules using imaging fiber bundles
AssigneesSchott Fiber Optics, Inc., University of Pittsburgh
InventorsDonald M. Chiarulli, Steven P. Levitan, Karim Tatah, Matthew Robinson
Life of this patent
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Abstract
Multipath structures formed from coherent fiber bundle structures for interconnecting a number of opto-electronic devices in a compact space. The coherent fiber bundle structures are formed from fiber optic plates and have different geometries and fiber orientations in order to transmit optic signal between opto-electronic device in different locations.
Claims18
An optical signal transmission device to connect optical signal emitters and detectors comprising:
- a multi-path structure, MPS, having at least three exterior faces, the MPS having at least first, second and third coherent fiber bundle structures, CFBSs, each of the CFBSs having at least a first, second, and third faces, at least the first and second faces being in optical communication with one another;
- the first face of the first CFBS forms at least a portion of the first exterior face of the MPS and the second face of the first CFBS forms at least a portion of the first and second exterior faces of the MPS;
- the first face of the second CFBS forms at least a second portion of the second exterior face of the MPS and the second face of the second CFBS forms at least a portion of the third exterior face of the MPS to provide optical communication between the second and third exterior faces of the MPS;
- and
- the first face of the third CFBS forms at least a second portion of the third exterior face of the MPS and the second face of the third CFBS forms at least a second portion of the first exterior face of the MPS to provide optical communication between the first and third exterior faces of the MPS;
- each of the exterior faces of the MPS being adapted to optically connect at least one of an optical signal emitter or optical signal detector to another of the exterior faces.
A method of transmitting optical signals between at least three opto-electronic chips through a one-piece optical signal transmission device having at least three sides comprising:
- providing a first opto-electronic device with at least one signal emitter and detector on a first side of the optical signal transmission device;
- providing a second opto-electronic device with at least one signal emitter and detector on a second side of the optical signal transmission device;
- providing a third opto-electronic device with at least one signal emitter and detector on a third side of the optical signal transmission device;
- optically connecting the at least one optical signal emitter on the first opto-electronic device with the at least one signal detector on the second opto-electronic device through a first coherent fiber bundle structure, CFBS, of the optical signal transmission device;
- optically connecting the at least one signal detector on the first opto-electronic device to the at least one signal emitter on the third opto-electronic device through a second CFBS of the optical signal transmission device;
- optically connecting the at least one optical signal emitter on the second opto-electronic device to the at least one signal detector on the third opto-electronic device through a third CFBS of the optical signal transmission device;
- emitting optical signals from the signal emitters on the first, second and third opto-electronic devices;
- transmitting the optical signals through the optical signal transmission device to the signal detectors;
- and
- receiving each of the emitted signals at the optically connected signal detector.
Dependencies are inferred from the claim text.