Dynamic isolating mount for processor packages
AssigneeHewlett-Packard Development Company, L.P.
InventorsDaniel L. Callahan, Raymond J. Iannuzzelli
Life of this patent
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Abstract
The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.
Claims7
A device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor, comprising:
- a printed wiring board;
- a processor;
- and
- a dynamic isolating mount compressed between said printed wiring board and said processor;
- said processor maintaining said dynamic isolating mount in a compressed state such that said dynamic isolation mount bears on said printed wiring board and such that the dynamic isolating mount is critically damped.
Dependencies are inferred from the claim text.