Method for manufacturing hybrid circuit board

Abstract

A required interlayer circuit board 1 is constituted so as to provide a punched portion in which only a collapsible cable portion 2 for connecting a plurality of component mounting portions to each other is exposed. An external layer board 6 is superimposed on at least one side of the internal layer circuit board 1 through an adhesive member 4 to which an opening portion 5 is formed at a position corresponding to the cable portion 2, the external layer substrate 6 having an opening portion 7 at a similar position. Thereafter, a wiring pattern for the component mounting portions is formed on the external layer board 6, and a blank and pierce process of the respective component mounting portions except the cable portion is carried out, thereby integrally connecting a plurality of the component mounting portions to each other through the collapsible cable portion.

Dependencies are inferred from the claim text.