Monitoring of film characteristics during plasma-based semi-conductor processing using optical emission spectroscopy
AssigneeApplied Materials, Inc.
InventorsHakeem Oluseyi, Moshe Sarfaty
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AssigneeApplied Materials, Inc.
InventorsHakeem Oluseyi, Moshe Sarfaty
Estimating the term…
A method and system to monitor characteristics of films by sensing the spectral emissions of a plasma to which the films are exposed. As a result, the method includes sensing optical energy produced by the plasma. The optical energy has a plurality of spectral bands associated therewith, a subset of which is identified as including information corresponding to the film characteristics. The film characteristics are then measured as a function of this information. To increase the accuracy of the measurements, in one embodiment of the present invention a subgroup of the plurality of spectral bands is observed that has data associated that is substantially independent of the characteristics of interest. The characteristics are then measured as a function of both the information and the data.
A method for monitoring characteristics of films exposed to a source of light in a semiconductor processing chamber, said method comprising:
A method for monitoring characteristics of films exposed to a plasma in a semiconductor processing chamber:
A system for monitoring characteristics of films exposed to a plasma in a semiconductor processing chamber, said system comprising:
A method for monitoring characteristics of films exposed to a source of light in a semiconductor processing chamber, said method comprising:
Dependencies are inferred from the claim text.