Apparatus and method for measuring the degradation of a tool

A machining apparatus comprising

• a semiconductor wafer cutting tool movably mounted for separating integrated circuits from a wafer;
• means for illuminating a sample area upon a tool surface with excitation radiation;
• means for receiving sample light emitted from the sample area;
• a spectral analyzer for performing a spectral analysis of the sample light received;
• and
• computer means for determining a condition of the tool at the sample area from the spectral analysis of the sample light, the computer means using the condition of the tool at the sample area to determine an optimal separation parameter of the machining apparatus and operating the machining apparatus at the optimal separation parameter.

A method for determining an operating condition of a semiconductor cutting tool comprising:

• illuminating a first sample area upon a tool surface with excitation radiation;
• receiving first sample area light emitted from the first sample area;
• spectral analyzing the first sample area light received;
• determining with a computer the operating condition of the tool at the first sample area from the spectrum of the first sample area light and adjusting a cutting speed of the semiconductor cutting tool in response thereto.

A method for controlling a machine having a semiconductor cutting tool comprising the steps:

• determining a condition of the semiconductor cutting tool by illuminating a first sample area upon a tool surface with excitation radiation;
• receiving first sample light emitted from the first sample area;
• spectral analyzing the first sample light received;
• continuously monitoring with a computer the condition of the tool at the first sample area from the spectrum of the first sample light;
• determining machining parameters of the machine dependent on the determined condition of the tool including a speed of the semiconductor cutting tool;
• and
• adjusting the speed of the semiconductor cutting tool to operate the tool with the determined machining parameters to make cuts in a semiconductor wafer between two integrated circuits.

A measurement head for determining a condition of a degrading edge of a wheel-like tool having a front face and first and second side faces substantially rectangular to the front face, comprising:

• guiding means for guiding illuminating radiation onto a sample area upon a tool surface;
• sample means for receiving sample light emitted from the sample area;
• wherein the measurement head is adapted to the wheel-like tool such that a front and first and second side sections of the sample area are upon the front and first and second side faces of the wheel-like tool, respectively;
• and
• a computer coupled to the sample means for determining the condition of the degrading edge of the wheel-like tool at the sample area from spectral analysis of the sample light, the computer using the condition of the wheel-like tool at the sample area to determine an optimal operating parameter of the wheel-like tool and to adjust the optimal operating parameter according to the condition which was determined.