Temperature compensated vertical pin probing device

An improved temperature compensated vertical pin probing device for probing integrated circuits over a large temperature range, the integrated circuits having spaced contact pads on a circuit substrate to be contacted by probe pins for testing, the probing device being of a known type comprising upper and lower spaced die members respectively, said upper and lower spaced die members having upper and lower patterns of holes therethrough corresponding to the integrated circuit contact pad spacing at a preselected temperature, and a plurality of probe pins-, each pin being disposed in a pair of upper and lower holes and extending beyond the lower die to terminate in a probe tip, the improvement comprising each die member having a spacer member with a coefficient of thermal expansion substantially matching that of the circuit substrate, each spacer member having an aperture therethrough, a thin sheet of ceramic material disposed in said aperture with a coefficient of thermal expansion substantially matching that of the circuit substrate, and an adhesive securing the sheet of ceramic material in said aperture, each sheet having a plurality of holes therethrough forming said upper and lower patterns of holes.