Semiconductor device on a packaging substrate
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsRyuiti Sahara, Nozomi Simoishizaka
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Abstract
A semiconductor device is to be mounted on a packaging substrate. The semiconductor device includes a first semiconductor chip, a plurality of first electrode pads provided on a surface of the first semiconductor chip on a side of the packaging substrate, for electrically connecting the first semiconductor chip to the packaging substrate, a second semiconductor chip mounted on the first semiconductor chip so as to be surrounded by the plurality of first electrode pads, and protruding electrodes respectively provided so as to protrude from the first electrode pads toward the packaging substrate so that their surfaces are substantially flush with a surface of the second semiconductor chip on a side of the packaging substrate.
Claims7
A semiconductor device to be mounted on a packaging substrate, comprising:
- a first semiconductor chip;
- a plurality of first electrode pads, provided on a surface of the first semiconductor chip on a side of the packaging substrate, for electrically connecting the first semiconductor chip to a packaging substrate;
- a second semiconductor chip mounted on the first semiconductor chip so as to be surrounded by the plurality of first electrode pads;
- protruding electrodes respectively provided so as to protrude from the first electrode pads toward a packaging substrate so that their surfaces are substantially flush with a surface of the second semiconductor chip on a side of a packaging substrate;
- and
- external electrodes respectively provided so as to correspond to the protruding electrodes, for connecting the protruding electrodes to a packaging substrate on which the semiconductor device is to be mounted;
- wherein the external electrodes are arranged on the surface of the second semiconductor chip on the side of a packaging substrate, and
- the semiconductor device further comprises wirings for connecting the protruding electrodes to the external electrodes corresponding to the protruding electrodes.
Dependencies are inferred from the claim text.