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US 6,633,030 B2Granted
Surface mountable optocoupler package
AssigneeFiarchild Semiconductor
InventorRajeev Joshi
Life of this patent
Estimating the term…
Abstract
An optocoupler package is disclosed. The optocoupler package comprises a carrier substrate and a plurality of conductive regions on the carrier substrate. An optoelectronic device, an optically transmissive medium, and a plurality of conductive structures can be on the carrier substrate.
Claims19
An optocoupler package comprising:
- a) a carrier substrate including a plurality of conductive regions;
- b) an optical emitter device on the carrier substrate;
- c) an optical receiver device on the carrier substrate;
- d) an optically transmissive medium disposed between the optical emitter device and the optical receiver device;
- and
- e) a plurality of solder structures on at least some of the conductive regions of the carrier substrate,
- wherein each of the solder structures in the plurality of solder structures have a dimension greater than the thicknesses of the optical emitter device and the optical receiver device.
4 more elements
An optocoupler package comprising:
- a) a carrier substrate including a plurality of conductive regions;
- b) an optical emitter device on the carrier substrate;
- c) a first wire coupling the optical emitter device to at least one of the plurality of conductive regions;
- d) an optical receiver device on the carrier substrate, wherein the optical receiver device is adapted to receive radiation from the optical emitter device;
- e) a second wire coupling the optical receiver device to at least one of the conductive regions;
- f) an optically transmissive medium disposed on and between the optical emitter device and the optical receiver device;
- and
- g) a plurality of solder structures on at least some of the conductive regions in the plurality of conductive regions and wherein each of the solder structures includes a dimension greater than the thicknesses of the optical receiver device and the optical emitter device.
5 more elements
An optocoupler apparatus comprising:
- a) a circuit substrate comprising a first plurality of conductive regions;
- and
- b) an optocoupler package comprising (i) a carrier substrate, (ii) a second plurality of conductive regions on the carrier substrate, (iii) an optical receiver device on the carrier substrate, (iv) an optical emitter device on the carrier substrate, (v) an optically transmissive medium disposed between the optical emitter device and the optical receiver device, and (vi) a plurality of solder structures on at least some of the second plurality of conductive regions of the carrier substrate,
- wherein the optocoupler package is mounted to the circuit substrate, and
- wherein each of the plurality of solder structures has a height greater than the heights of the optical emitter device and the optical receiver device.
2 more elements
A method for forming an optocoupler package comprising:
- a) mounting an optical emitter device on a carrier substrate with a plurality of conductive regions;
- b) mounting an optical receiver device on the carrier substrate;
- c) forming an optically transmissive medium on the optical emitter device and the optical receiver device;
- and
- d) forming a plurality of solder structures on at least some of the conductive regions of the carrier substrate,
- wherein each of the plurality of solder structures has a height greater than the heights of the optical emitter device and the optical receiver device.
3 more elements
A surface mountable optocoupler package comprising:
- a) a carrier substrate including a plurality of conductive regions;
- b) an optical emitter device on the carrier substrate;
- c) an optical receiver device on the carrier substrate;
- d) an optically transmissive medium disposed between the optical emitter device and the optical receiver device;
- and
- e) a plurality of conductive structures on at least some of the conductive regions of the carrier substrate,
- wherein the surface mountable optocoupler package is capable of being mounted to a circuit structure, and
- wherein each of the plurality of conductive structures has a height greater than the heights of the optical emitter device and the optical receiver device.
5 more elements
Dependencies are inferred from the claim text.